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ALD deposition equipment - メーカー・企業と製品の一覧

ALD deposition equipmentの製品一覧

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Creative Coatings "Vapor Technology"

We will introduce the technologies and processing examples we propose based on the work material, film type, and film thickness!

"Vapor phase technology" is utilized in various fields such as 'new materials and substances' and 'energy' including resin raw materials and fuel cells, as well as in 'medical and healthcare' applications like medical sensors and devices, and in 'mobile devices', 'wearable devices', and 'automotive' sectors including electronic components and new displays. Additionally, it achieves film formation in the range of 1nm to 1000nm with diverse processes, film thicknesses, and types. Coating is performed using deposition methods such as evaporation, CVD, ALD, and sputtering. 【Features】 ■ ALD Robot CVA series Enables high-quality film formation at low temperatures, which is considered difficult in ALD. ■ Barrel-type ALD Robot CVA-B series A fusion of low-temperature ALD equipment and barrel mechanism. ■ Low-temperature high-frequency excitation DLC film formation device CVC series Allows for good adhesion film formation from graphite to DLC at low temperatures. ■ Bubbling CVD Robot CVB series Liquid to gas Enables low-cost and high-quality film formation at low temperatures. ■ IBAD (Ion Beam Assisted Deposition) CVI series Examples of contract film formation using IBAD Allows for low-energy irradiation at low temperatures, improving the adhesion of transparent conductive films (Zn O) and high-melting-point metal electrode formation for touch panels.

  • Contract manufacturing

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F.A.S.T Solution

High-quality oxide, nitride, and metal films can be deposited with a high film formation rate!

"KOBUS-F.A.S.T" is a solution that achieves high-quality thin film deposition processing, not only through the F.A.S.T process that balances the coverage of ALD and the deposition rate of PECVD but also enables ALD deposition. It is used for applications involving base layer SiO2, barrier layer TiO2, and metal layers Cu, Co, or transparent conductive ZnOx with ALD and F.A.S.T high-rate deposition while maintaining good coverage. This is recommended for engineers who are exploring methods to improve deposition speed while maintaining film quality and coverage in ALD deposition. 【Features】 ■ A process that balances the coverage of ALD and the deposition rate of PECVD ■ ALD deposition is also possible with this equipment ■ Capable of high-quality deposition of oxides, nitrides, and metals with high deposition rates *For more details, please feel free to contact us.

  • others

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録